¿Cual es la causa principio de la problama de doblado el PCB?

  • There are various reasons the cause the PCB bending issue. The most common one is when the stress applied to the PCB is greater than the stress which PCB itself can withstand, the PCB bending issue occurs right immediately.
  • When PCBs go through the reflow oven for SMT process, the major source stress is the “high temperature”. High temperature will soften the PCBs, plus the factor of Coefficient of Thermal Expansion (CTE) and the characteristic of thermal expansion and contraction of PCB, if the temperature reaches the upper limit of the TG value of the PCBs, than the PCBs will bend.
  • The PCB designers rarely consider whether there is copper on the PCB edge. On the circumstances of without copper on the PCB edge, the PCB will easily bend while high temperature.
  • Also if the size of PCB is relatively big and the SMD components are heavy. The PCB bending issue will occur because of the weight.
  • The V-cut designed for conveniently separating the PCB will also destroy the structure of the PCB, and easily cause the PCB bending issue.
         

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