HDI Board and Its Applications

  • The definition of HDI: The American IPC-2315 standard considers that the minimum conductor width and spacing of the design are ≤0.10 mm, the (mechanical or laser) through hole diameter is ≤0.15 mm, and there are buried and/or blind holes between layers, is called HDI board.
  • HDI boards are generally manufactured by layer-by-layer method, the more the number of layers, the higher the technical grade of the board. Ordinary HDI boards are basically one-time build-up. High level HDI uses two-time or more build-up technology. At the same time, advanced PCB technologies such as stacking holes, electroplating hole filling, and laser drilling are used.
  • When the PCB increases to more than eight layers, and manufactured with HDI, its cost will be lower than that of the traditional and complex laminated process. HDI board is conducive to the use of advanced packaging technology, and its electrical performance and signal accuracy are higher than traditional PCB. In addition, HDI boards have better improvements in radio frequency interference, electromagnetic wave interference, electrostatic discharge, and heat conduction.
  • Features of HDI board:
    1. Increase the wiring area and the line density
    2. Reduce the thickness of the insulating medium, and the thickness and weight of the board
    3. Shorten the wire interconnection length, reduce electrical signal interference and loss
    4. The thickness of the via hole is relatively small, which improves the interconnection reliability
    5. The structure design of the via hole is convenient, the design freedom is large, and the design efficiency is improved
  • The main application of HDI board is that HDI started with the development of mobile phones, and expanded the market and improved performance as feature phones were transformed into smart phones. HDI boards are now used in electronic devices outside of mobile phones, such as notebook computers and tablet computers, automotive electronics, aerospace, medical devices and wearable electronic devices, robots and smart devices.
        

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