Chamfering V.S. Beveling on PCB

In the printed circuit board (PCB) industry, chamfering and beveling are two common techniques used to modify the edges of the board. While the two terms may be used interchangeably in some contexts, they are actually distinct processes with different purposes and outcomes.

Chamfering involves cutting or grinding away a small portion of the edge of the board at a 45-degree angle. This results in a beveled edge that is less sharp and less likely to catch on other materials or objects. Chamfering is often used on the corners of a PCB to prevent damage during handling or installation. It can also be used to create a visual effect, such as giving the board a more polished or finished appearance.

On the other hand, beveling involves cutting or grinding away a larger portion of the edge of the board at an angle other than 45 degrees. This results in a sloped edge that can be used for specific purposes, such as fitting the board into a particular shape or housing. Beveling can also be used to reduce the overall size of the board while maintaining functionality, or to create a more aerodynamic shape for applications such as drone or UAV electronics.

In summary, chamfering and beveling are both edge modification techniques commonly used in the PCB industry. Understanding the difference between these two techniques can help PCB manufacturers choose the most appropriate method for their specific needs.