Precautions for PCB manufacturing in extreme environments
Compared with electronic products used in ordinary environments, electronic products used in extreme environments need to meet higher manufacturing requirements. As the core of electronic products, PCB is extremely important in controlling its performance.
PCB materials must be fully considered in PCB manufacturing and layout. As far as extreme environments are concerned, materials that can withstand extremely high temperatures should be selected, such as FR4-008 or PI.These materials can not only withstand extremely high temperatures, but also won't cause the solder mask to detach.
Since PCBs that will be used in extreme environments usually have to withstand extremely high heat and temperature fluctuations, the board should be prevented from warping, otherwise it may cut off the circuit, damage the solder joints, and cause problems during the application process.
During the PCB assembly process, inspections must be carried out to ensure the quality of the final product. For example, AOI instruments should be used to check the performance of solder joints. The solder paste thickness meter is used to determine whether the solder paste has the best thickness, and whether the thickness is helpful for smooth reflow soldering in the subsequent steps of SMT assembly.
PCB materials must be fully considered in PCB manufacturing and layout. As far as extreme environments are concerned, materials that can withstand extremely high temperatures should be selected, such as FR4-008 or PI.These materials can not only withstand extremely high temperatures, but also won't cause the solder mask to detach.
Since PCBs that will be used in extreme environments usually have to withstand extremely high heat and temperature fluctuations, the board should be prevented from warping, otherwise it may cut off the circuit, damage the solder joints, and cause problems during the application process.
During the PCB assembly process, inspections must be carried out to ensure the quality of the final product. For example, AOI instruments should be used to check the performance of solder joints. The solder paste thickness meter is used to determine whether the solder paste has the best thickness, and whether the thickness is helpful for smooth reflow soldering in the subsequent steps of SMT assembly.