Diferencia entre cobre de ED y RA en la aplicación de la placa flexible
(FPC).

With more people opt for small electronic devices, it has increased the needs of Flexible boards(FPC) applications for PCB manufacturer. Understanding the differences between ED copper and RA copper, will help PCB designers to choose suitable printed circuit board materials in order to prolong the lifetime of PCB products.

• Both ED copper and RA copper are a type of copper foil for flexible boards(FPC). They are a layer of conductive attached to the outer surface of the non-conductive substrate.
• During PCB manufacturing process, the ED copper that uses in flexible boards(FPC) is made by using electrolysis method, its crystals tend to grow lengthwise, with long crystal boundaries perpendicular which makes it easy to break. Whereas the RA copper is made by rolling operation, its crystals are smaller and have spherical shapes which give it great extension.
• Few tips when choosing the flexible boards(FPC) materials. RA copper has weaker conductivity than ED copper, however, it has much better extensibility, which can reach to 20-45%. RA copper is great for flexible boards(FPC) that needs to bend frequently.
• As for PCB products that has less bending requirement, for example: keypads, module boards. The ED copper could be a choice with it great conductivity and lower cost for PCB manufacturers. On the contrary, RA copper will be an excellent choice for bendable boards such as flip phone, Zoom optical lenses.