Distinction Between Traditional Dry Film and Laser Dry Film

In a previous article, we introduced inner layer processing and pretreatment. Today, we will focus on exploring the dry film aspect.

Traditional Dry Film Process

1. Use a photomask to transfer the design pattern onto the dry film via exposure.
2. Perform the development process to remove unexposed areas, leaving the desired pattern.
3. Proceed with etching or electroplating.

Application Scenario: Suitable for mass production of PCBs with moderate specification requirements.

Laser Dry Film (Laser Direct Imaging, LDI) Process

1. No photomask is required; the laser directly draws the design pattern onto the dry film.
2. After laser imaging, perform development to remove unexposed areas.
3. Continue with etching or electroplating.

Application Scenario: Ideal for high-density PCBs and semiconductor package substrates (e.g., BGA, CSP) requiring precise patterns.

Advantages and Future Trends

• Advantages of Laser Dry Film:

  • Eliminates the labor and material costs associated with photomasks.
  • Accurately meets the increasing demands for high-density and high-performance modern electronics.
  • Better suited for rapid design iteration and customization needs.

• Future Trends:
  As LDI equipment costs decrease and the technology becomes more widespread, laser dry film technology will gradually become mainstream, particularly in the production of high-end electronic products and semiconductor substrates.