Can ENIG Replace ENEPIG for Wire Bonding?

When it comes to wire bonding, the first choice could be ENEPIG. ENEPIG seems to be the most stable one for wire bonding, however, the production cost is much higher than other surface finish. Here is one solution of using ENIG instead of ENEPIG by increasing the thickness of Au to 5u”.
See below pulling test condition and result of showing performance of using ENEPIG and ENIG.

Test condition:
To use 1.0 mil gold wire and pull strength to be above 3 grams force. (as TM-650 2.4.42.3)
PCB A is as ENEPIG finish with Ni:200u”; Pd:2u”; Au:2u”
PCB B is as ENIG finish with Ni:200u”; Au:5u”


Result:
PCB A: 5.091 ~ 11.186 (g)
PCB B: 4.432 ~ 12.030 (g)

To sum up, both ENEPIG and ENIG are ok for wire bonding.