What is the bonding on the PCB?
Bonding, that is, chip bonding, chip coating. Bonding is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the chip to the package pins with gold wires before packaging.
What will be done after bonding (after the circuit is connected to the pin)?
The chip is packaged with glue, and use the packaging technology, COB (Chip On Board). The tested wafer is implanted on a special circuit board, and then the wafer circuit is connected to the circuit board with a gold wire, then after melting, the organic material with special protective function is covered on the wafer to complete the later packaging of the chip.
What are the advantages of Bonding?
- The bonding chip is anti-corrosion, anti-vibration, and stable performance:
The advantage of this packaging method is that the stability of the finished product is better than that of the traditional SMT patch method. Because the circuit board is affected by moisture, natural and human, it is prone to short circuit and open circuit. The bonding chip is protected by organic materials, and isolated from the outside, there is no moisture, static electricity, and corrosion.
- Bonding wafers are suitable for mass production: The product has strong consistency and long service life. This packaging technology has the advantages of low cost, space saving, light weight, good heat dissipation, and simple packaging method.
- Application of bonding:
Many of the LCD screens of mobile phones, PDAs, MP3 players, digital cameras, and game consoles will use bonding.