What is COB
(Chip On Board)? Introduce the Evolution History of COB
COB (Chip On Board) has already been a mature technology in the electronics manufacturing industry. Previously, COB was mostly only used in some low-end consumer products. However, as electronic products become smaller and smaller, the COB process can be used for smaller space more than IC.
COB is to transplant the wire bonding and capsule operations of IC packaging to the circuit board, and re-adhere the die that was originally pasted to the lead-frame to the PCB. Re-solder the wires that were originally bonded to the lead frame to the gold-plated pads of the PCB, and then use Epoxy to cover the wafers and wires to replace the original mold package.
The advantages of COB
COB is to transplant the wire bonding and capsule operations of IC packaging to the circuit board, and re-adhere the die that was originally pasted to the lead-frame to the PCB. Re-solder the wires that were originally bonded to the lead frame to the gold-plated pads of the PCB, and then use Epoxy to cover the wafers and wires to replace the original mold package.
The advantages of COB
COB can save the original IC packaging Trimming & Form and marking processes, and it can also reduce the cost of the IC packaging factory's sales and marketing, so basically its process will be cheaper than the IC packaging process.