On the PCB, besides BGA and SOP, are there other mainstream package types?
Basically, chip packaging is to put the substrate on a board, lead out the pins, and then fix them into a whole, it has the function of protecting the chip. It not only has fixed functions, but also increases thermal performance. Therefore, chip packaging is very important for circuits such as CPU.
Semiconductor packaging has undergone three times innovations: the first was from pin-insert packaging to surface mount packaging in the 1990s, which greatly increased the assembly density on the board; the second was the emergence of ball matrix packaging in the 2000s. It meets the market's demand for high pins and improves the performance of semiconductor devices; chip-level packaging, system packaging, etc. are the products of the third innovation, and its purpose is to minimize the packaging area. At present, the mainstream chip packaging types mainly include the following types: BGA, SOP, TSOP, SIP, etc.
BGA : Today, most high pin count chips use BGA. The contact surface between the BGA array ball soldering and the substrate is large and short, which is good for heat dissipation; the pins of the BGA array solder balls are very short, which shortens the signal transmission path, reduces the lead inductance and resistance, and the signal transmission delay is small, adapting to the frequency greatly improved, thus improving the performance of the circuit.
SOP : The typical feature of this type of package is that many pins are made around the packaged chip. The package is easy to operate and has relatively high reliability. It is one of the mainstream chip package methods.
TSOP : TSOP is suitable for routing on PCB with SMT technology. When the package size of TSOP is lower, the parasitic parameters (when the current changes greatly, the output voltage disturbance is caused) are reduced, which is suitable for high-frequency applications, and the operation is more convenient and the reliability is relatively high.
SIP : SIP package is to integrate multiple functional chips, including processors, memory and other functional chips into one package, so as to realize a basically complete function. SIP packaging is widely used in wireless communications, automotive electronics, medical electronics, computers, military electronics and other fields.
To sum up, packaging is an important step in the finished product of memory chips, and plays an important role in the yield rate and service life of chips.
Semiconductor packaging has undergone three times innovations: the first was from pin-insert packaging to surface mount packaging in the 1990s, which greatly increased the assembly density on the board; the second was the emergence of ball matrix packaging in the 2000s. It meets the market's demand for high pins and improves the performance of semiconductor devices; chip-level packaging, system packaging, etc. are the products of the third innovation, and its purpose is to minimize the packaging area. At present, the mainstream chip packaging types mainly include the following types: BGA, SOP, TSOP, SIP, etc.
BGA : Today, most high pin count chips use BGA. The contact surface between the BGA array ball soldering and the substrate is large and short, which is good for heat dissipation; the pins of the BGA array solder balls are very short, which shortens the signal transmission path, reduces the lead inductance and resistance, and the signal transmission delay is small, adapting to the frequency greatly improved, thus improving the performance of the circuit.
SOP : The typical feature of this type of package is that many pins are made around the packaged chip. The package is easy to operate and has relatively high reliability. It is one of the mainstream chip package methods.
TSOP : TSOP is suitable for routing on PCB with SMT technology. When the package size of TSOP is lower, the parasitic parameters (when the current changes greatly, the output voltage disturbance is caused) are reduced, which is suitable for high-frequency applications, and the operation is more convenient and the reliability is relatively high.
SIP : SIP package is to integrate multiple functional chips, including processors, memory and other functional chips into one package, so as to realize a basically complete function. SIP packaging is widely used in wireless communications, automotive electronics, medical electronics, computers, military electronics and other fields.
To sum up, packaging is an important step in the finished product of memory chips, and plays an important role in the yield rate and service life of chips.
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