Brief Introduction Process of COB
(Chip On Board)

The key technique of COB (Chip On Board) is Wire Bonding and Molding, which is the process to package exposed integrated circuit (IC) as electronic component. The integrated circuit (IC) to extend its I/O through trace of package by Wire Bonding, Flip Chip, or Tape Automatic Bonding (TAB).


The process of COB is as follows.

                                                                                                  Rework 
                                                                                                       ↓
Die In →  Clear  →  Dispensing  →  Die Attach → Curing → Wire Bond  →  Testing → Coating → Curing → Visual Check  → Testing → FQC  → Packing  →  Delivery
                                   ↑
                              Rework 
             
Environmental requirement of COB – Clean Room

The Clean Room class must be above class 100000. Normally the Clean Room class of IC package testing shall be class 10000 or even class 1000. Clean Room for Wafer Fabrication is even higher.