ExPlus to Showcase Cutting-Edge PCB Solutions at NEPCON Osaka 2025

We’re excited to announce that ExPlus will be exhibiting at NEPCON Osaka 2025—Japan’s leading electronics event!

-Date:May 16-18, 2025
-Location: INTEX Osaka, Japan
-Booth No.: K4-19


What to Expect from ExPlus at NEPCON Osaka 2025

At Booth K4-19, ExPlus will present its latest innovations in PCB (Printed Circuit Board) design and manufacturing, offering advanced solutions tailored for today’s high-performance electronics industry. As a long-time partner to clients worldwide, ExPlus will showcase:

-High-frequency and multilayer PCB technologies
-Rapid prototyping and small-volume production capabilities
-Industry-compliant quality assurance and inspection systems
-Customized solutions for automotive, medical, and industrial electronics

By attending NEPCON Osaka 2025, visitors will have the exclusive opportunity to engage directly with our team, explore technical samples, and discuss customized PCB strategies.


Why Visit ExPlus at NEPCON Osaka 2025?

With decades of expertise and a commitment to customer satisfaction, ExPlus continues to drive innovation in the PCB industry. Our presence at NEPCON Osaka 2025 reinforces our dedication to supporting Japan’s growing demand for high-quality circuit board solutions.

Whether you are looking for flexible production options, enhanced quality assurance, or a reliable global partner—ExPlus is here to help you bring your next-generation product to life.


Let’s Connect in Osaka!
If you're planning to attend NEPCON Osaka 2025, don’t miss the chance to meet ExPlus in person. Contact us in advance to schedule a one-on-one meeting or demo. We look forward to collaborating and sharing insights into the future of PCB technology.

For more information, feel free to contact us or follow our updates.

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