The packaging methods for Flying Lead, TAB and COF
Flex PCB: Also known as a flexible printed circuit board (FPC).
In a previous article, we introduced rolled-annealed copper (RA) and electro-deposited copper (ED).
Today, let's talk about the Flying Lead packaging method.
Flying Lead is a packaging method for flexible boards/high-density flexible boards, which refers to the design and manufacturing method of a connector used to connect PCBs with other devices or systems. It is not specific to a particular type of PCB or packaging method. Therefore, Flying Lead can be applied to various types of PCBs, including rigid PCBs, soft boards, and high-density flexible boards.
There are two common methods for Flying Lead in soft boards (FPC), namely TAB and COF.
TAB (Tape Automated Bonding) is a method that uses a plastic substrate to transfer the conductive circuit onto another substrate and connects the conductive circuit to the chip pins through gold plating. This method requires a longer
In a previous article, we introduced rolled-annealed copper (RA) and electro-deposited copper (ED).
Today, let's talk about the Flying Lead packaging method.
Flying Lead is a packaging method for flexible boards/high-density flexible boards, which refers to the design and manufacturing method of a connector used to connect PCBs with other devices or systems. It is not specific to a particular type of PCB or packaging method. Therefore, Flying Lead can be applied to various types of PCBs, including rigid PCBs, soft boards, and high-density flexible boards.
There are two common methods for Flying Lead in soft boards (FPC), namely TAB and COF.
TAB (Tape Automated Bonding) is a method that uses a plastic substrate to transfer the conductive circuit onto another substrate and connects the conductive circuit to the chip pins through gold plating. This method requires a longer
The COF (Chip on Film) method involves directly connecting chips to the FPC, requiring shorter flying leads and enabling implementation in smaller spaces. This method requires higher technical requirements and costs, but can achieve higher conductivity and reliability.
Both manufacturing methods have their advantages and disadvantages, so it is crucial to choose the appropriate method based on customer requirements and project needs.