Inner Layer Process
(I): Panel Cutting and Pre-Treatment

What is panel cutting in PCB manufacturing?

Panel cutting is the process of cutting large PCB laminate sheets into smaller production panels suitable for inner layer fabrication and subsequent PCB processing steps.

Why is pre-treatment important before the inner layer process?
Pre-treatment removes oxidation, dust, oil, and contaminants from the copper surface to improve dry film adhesion and ensure accurate circuit imaging.

What does micro-etching do during PCB pre-treatment?
Micro-etching slightly roughens the copper surface to enhance bonding between the copper layer and the dry film photoresist used in imaging.

What problems can occur without proper pre-treatment?
Improper pre-treatment can cause poor dry film adhesion, uneven etching, open or short circuits, and reduced PCB reliability.

What process comes after panel cutting and pre-treatment?
After pre-treatment, the PCB proceeds to dry film lamination, UV exposure, developing, and etching to create the inner layer circuit patterns.

Learn more: Inner Layer Process (I): Panel Cutting and Pre-Treatment