What Is Solderability Test and Its Purpose?
To ensure the reliability of PCB, PCB manufacturer will conduct multiple tests. One of destructive testing is Solderability test. It’s essential that there’s no delamination after Solderability test.
Testing method might slightly vary from manufacturer to manufacturer. Refer to IPC-TM 650 Solder float experiment, the operator will float the specimen for 4~5 seconds on the surface of a solder bath maintained at 260 +/- 5°C. Or the operator will dip the specimen for 10 seconds in a solder bath maintained at 288 +/- 5°C. This operation shall be repeated 2~3 times. The 2nd method called Edge dip test. Both methods could test the reliability of PCB and ensure the quality of Printed Circuit Board.
⇣⇣⇣ For more PCB tests before delivery. ⇣⇣⇣
What is E-Test?
What is Hi-Pot Test?


