Several Factors Affecting PCB RF Performance
Several Factors Affecting PCB RF Performance
Nowadays, the electronic products have feature of SoC (System on Chip), all functions and performances are almost defined by IC. However, even with the same IC and functions, the products designed by different companies, still have different performance. What factors cause these differences?
Here, we list several factors that contribute to the difference in performance.
Nowadays, the electronic products have feature of SoC (System on Chip), all functions and performances are almost defined by IC. However, even with the same IC and functions, the products designed by different companies, still have different performance. What factors cause these differences?
Here, we list several factors that contribute to the difference in performance.
- Metal: copper foil type and roughness, surface finish type (ENIG, HSAL…)
- Glass Fabric: different glass styles (106, 1080, 2113…etc.) and weave styles.
- DK (Dielectric constant)
- DF (loss tangent)
- Vias: Various via options for RF routing (buried via / blind via / backdrill)