Lamination is coming after Black Oxidation

When inner layer is done, no matter how many layers there are, we will have to have them all laminated together. The key elements which decide whether the lamination is good or bad are black oxidation and the precision of positioning.
To be briefly speaking, black oxidation is a process between inner layer and lamination that cleans PCB and make it sticky for better combination of copper and epoxy.



Having all inner layers lay-up and positioning well, lamination process is done to laminate them together to be one single compound.